Beijing, China, September 4, 2026 — Xiaomi is preparing to launch the Xiaomi 18 Fold, its latest foldable smartphone and the first handset expected to feature the company’s new in-house Xring O3 processor.
The Xiaomi 18 Fold is scheduled to be officially unveiled in China on September 7. The device has already been showcased publicly, giving users an early look at a new foldable design that differs significantly from Xiaomi’s previous Mix Fold smartphones.
Instead of the relatively narrow form factor associated with earlier models, the Xiaomi 18 Fold adopts a wider design. Xiaomi has described the device as a new “mid-fold” form factor, positioned between conventional large book-style foldables and smaller smartphones.
Xiaomi 18 Fold showcased at IFA 2026, featuring the company’s in-house Xiaomi XRING O3 chip, designed to power advanced AI capabilities across the Xiaomi ecosystem.
The company has revealed that the phone will feature a 5.38-inch outer display and a larger 7.58-inch internal display. The device also has a horizontal rear camera module housing three cameras.
One of the Xiaomi 18 Fold's biggest features will be the Xring O3 chipset, Xiaomi's latest in-house processor. The chip is expected to play a central role in the company's artificial intelligence strategy, with the phone also set to feature HyperOS 4 and on-device MiMo AI capabilities.
